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Modeling and Simulation for Microelectronic Packaging Assembly
Language: en
Pages: 586
Authors: Shen Liu
Categories: Technology & Engineering
Type: BOOK - Published: 2011-08-24 - Publisher: John Wiley & Sons

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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba
Modeling and Simulation for Microelectronic Packaging Assembly
Language: en
Pages: 576
Authors:
Categories:
Type: BOOK - Published: 2011 - Publisher:

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Language: en
Pages: 477
Authors: E-H Wong
Categories: Technology & Engineering
Type: BOOK - Published: 2015-05-23 - Publisher: Woodhead Publishing

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime
Wafer-Level Chip-Scale Packaging
Language: en
Pages: 336
Authors: Shichun Qu
Categories: Technology & Engineering
Type: BOOK - Published: 2014-09-10 - Publisher: Springer

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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, rel
Wireless Medical Systems and Algorithms
Language: en
Pages: 259
Authors: Pietro Salvo
Categories: Technology & Engineering
Type: BOOK - Published: 2017-11-22 - Publisher: CRC Press

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Wireless Medical Systems and Algorithms: Design and Applications provides a state-of-the-art overview of the key steps in the development of wireless medical sy
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