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This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.

Review of the Research Program of the U.S. DRIVE Partnership: Fifth Report follows on four previous reviews of the FreedomCAR and Fuel Partnership, which was th

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe

With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in

This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines