Book excerpt: The revolutionary progress in semiconductor, communication, and information industries based on electronic and photonic technologies demands for the development and enhancement of new laser processes to support micro and nanotechnologies. This dissertation is aimed at exploring the use of lasers for micro and nano scale processing of glass and silicon, the most commonly used materials in the IC industry. The objective of the dissertation is two fold: (a) use lasers for locally micro bonding glass and silicon wafers, and (b) use lasers for nanopatterning glass and silicon substrates by circumventing the diffraction limit of light.