Search Results

Advanced Packaging

Download or Read eBook Advanced Packaging PDF written by and published by . This book was released on 2009-01 with total page 28 pages. Available in PDF, EPUB and Kindle.
Advanced Packaging
Author :
Publisher :
Total Pages : 28
Release :
ISBN-10 :
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis Advanced Packaging by :

Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.


Advanced Packaging Related Books

Advanced Packaging
Language: en
Pages: 28
Authors:
Categories:
Type: BOOK - Published: 2009-01 - Publisher:

DOWNLOAD EBOOK

Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing
Semiconductor Advanced Packaging
Language: en
Pages: 513
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2021-05-17 - Publisher: Springer Nature

DOWNLOAD EBOOK

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Materials for Advanced Packaging
Language: en
Pages: 974
Authors: Daniel Lu
Categories: Technology & Engineering
Type: BOOK - Published: 2016-11-18 - Publisher: Springer

DOWNLOAD EBOOK

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have
Semiconductor Packaging
Language: en
Pages: 216
Authors: Andrea Chen
Categories: Technology & Engineering
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

DOWNLOAD EBOOK

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semic
Wafer-Level Chip-Scale Packaging
Language: en
Pages: 336
Authors: Shichun Qu
Categories: Technology & Engineering
Type: BOOK - Published: 2014-09-10 - Publisher: Springer

DOWNLOAD EBOOK

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, rel
Scroll to top