Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation)
Download or Read eBook Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation) PDF written by and published by . This book was released on 2013 with total page 0 pages. Available in PDF, EPUB and Kindle.
| Author | : |
| Publisher | : |
| Total Pages | : 0 |
| Release | : 2013 |
| ISBN-10 | : OCLC:1407143966 |
| ISBN-13 | : |
| Rating | : 4/5 (66 Downloads) |
Book Synopsis Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications (Presentation) by :
Book excerpt: This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.
