Search Results

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II

Download or Read eBook Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II PDF written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 290 pages. Available in PDF, EPUB and Kindle.
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
Author :
Publisher : The Electrochemical Society
Total Pages : 290
Release :
ISBN-10 : 1566773903
ISBN-13 : 9781566773904
Rating : 4/5 (03 Downloads)

Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II by : G. S. Mathad

Book excerpt:


Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II Related Books

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics
Language: en
Pages: 262
Authors: G. S. Mathad
Categories: Science
Type: BOOK - Published: 2001 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II
Language: en
Pages: 290
Authors: G. S. Mathad
Categories: Science
Type: BOOK - Published: 2003 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics
Language: en
Pages: 71
Authors: G. Mathad
Categories: Science
Type: BOOK - Published: 2009-03 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Low k Inter-Level Metal Dielectrics and New Contact and Barri
Copper Interconnects, New Contact Metallurgies/structures, and Low-k Inter-level Dielectrics
Language: en
Pages: 61
Authors: Electrochemical Society
Categories: Technology & Engineering
Type: BOOK - Published: 2008 - Publisher:

DOWNLOAD EBOOK

Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics
Language: en
Pages: 364
Authors:
Categories: Electronic packaging
Type: BOOK - Published: 2003 - Publisher: The Electrochemical Society

DOWNLOAD EBOOK

Scroll to top