Search Results

Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products

Download or Read eBook Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products PDF written by Charles Ume and published by . This book was released on 2001 with total page 322 pages. Available in PDF, EPUB and Kindle.
Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products
Author :
Publisher :
Total Pages : 322
Release :
ISBN-10 : UOM:39015055444023
ISBN-13 :
Rating : 4/5 (23 Downloads)

Book Synopsis Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products by : Charles Ume

Book excerpt:


Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products Related Books

Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products
Language: en
Pages: 322
Authors: Charles Ume
Categories: Technology & Engineering
Type: BOOK - Published: 2001 - Publisher:

DOWNLOAD EBOOK

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Language: en
Pages: 1471
Authors: Ephraim Suhir
Categories: Technology & Engineering
Type: BOOK - Published: 2007-05-26 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-
The Electronic Packaging Handbook
Language: en
Pages: 937
Authors: Glenn R. Blackwell
Categories: Technology & Engineering
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

DOWNLOAD EBOOK

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerati
Encyclopedia of Packaging Materials, Processes, and Mechanics
Language: en
Pages: 1079
Authors: Avram Bar-Cohen
Categories: Packaging
Type: BOOK - Published: 2019 - Publisher: World Scientific

DOWNLOAD EBOOK

"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliabili
Electronic Packaging
Language: en
Pages: 0
Authors: John H. Lau
Categories: Electronic packaging
Type: BOOK - Published: 1998 - Publisher: McGraw-Hill Professional Publishing

DOWNLOAD EBOOK

Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state
Scroll to top