Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications
Download or Read eBook Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications PDF written by Douglas DeVoto and published by . This book was released on 2011 with total page 23 pages. Available in PDF, EPUB and Kindle.
| Author | : Douglas DeVoto |
| Publisher | : |
| Total Pages | : 23 |
| Release | : 2011 |
| ISBN-10 | : OCLC:969973002 |
| ISBN-13 | : |
| Rating | : 4/5 (02 Downloads) |
Book Synopsis Thermal Performance and Reliability of Bonded Interfaces for Power Electronics Packaging Applications by : Douglas DeVoto
Book excerpt:
